低温退火提高a-ZIO TFT电路的稳定性

A. Dey, D. Allee
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引用次数: 0

摘要

长时间的低温热退火表明低温制备的非晶氧化锌铟薄膜晶体管(TFTs)的性能和稳定性得到了提高。与未退火tft的2.2 V位移相比,50小时退火tft的导通电压(Von)在104 s的正栅极偏置应力周期内移位1.5 V。性能和稳定性的提高是由于a- zio的界面陷阱密度的降低和带隙缺陷态的消除。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Stability improvement of a-ZIO TFT circuits using low temperature anneal
Long duration of low temperature thermal anneals show performance and stability enhancement for low-temperature fabricated amorphous zinc-indium-oxide (a-ZIO) thin-film-transistors (TFTs). The turn-on voltage (Von) of 50 hour annealed TFTs shifts by 1.5 V for a positive gate bias stress period of 104 s when compared to a 2.2 V shift for the unannealed TFTs. The performance and stability improvements are attributed to a reduction of the interface trap density and removing of defects states in the band-gap of the a-ZIO.
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