新开发的Test-Element-Group采用双嵌套阵列检测低阻元件的软故障

2013 IEEE International Conference on Microelectronic Test Structures (ICMTS) Pub Date : 2013-03-25 DOI:10.1109/ICMTS.2013.6528152

S. Sato, H. Shinkawata, A. Tsuda, T. Yoshizawa, T. Ohno

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引用次数: 2

摘要

本文报道了采用双嵌套阵列检测互连等低阻元件软故障的新方法Test-Element-Group。我们使用40nm CMOS技术制造的这种结构检测到微细通孔的软失效，其电阻比普通通孔的电阻大10倍左右。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Newly developed Test-Element-Group for detecting soft failures of the low-resistance-element using doubly nesting array

We report newly developed Test-Element-Group for detecting soft failures of low-resistance-element like interconnect via using doubly nesting array. We detected the soft failure of fine via which resistance had about 10 times larger resistance than normal via using this structure manufactured in 40nm CMOS technology.

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2013 IEEE International Conference on Microelectronic Test Structures (ICMTS)

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