2013 IEEE International Conference on Microelectronic Test Structures (ICMTS)

Test structure and analysis for accurate RF-characterization of tungsten through silicon via (TSV) grounding devices

Pub Date : 2013-03-25 DOI: 10.1109/ICMTS.2013.6528141 V. Blaschke, H. Jebory

Test structures for electrical evaluation of high aspect ratio TSV arrays fabricated using planarised sacrificial photoresist

Pub Date : 2013-03-25 DOI: 10.1109/ICMTS.2013.6528142 R. Zhang, Y. Li, J. Murray, A. Bunting, S. Smith, C. Dunare, J. Stevenson, M. Desmulliez, A. Walton

Reconsideration of the threshold voltage variability estimated with pair transistor cell array

Pub Date : 2013-03-25 DOI: 10.1109/ICMTS.2013.6528155 K. Terada, N. Higuchi, K. Tsuji