Z. Chen, B. Talebanpour, Z. Huang, P. Kumar, I. Dutta
{"title":"工艺对三维封装焊料微凸点显微组织及断裂的影响","authors":"Z. Chen, B. Talebanpour, Z. Huang, P. Kumar, I. Dutta","doi":"10.1109/EPTC.2013.6745777","DOIUrl":null,"url":null,"abstract":"Solder microbumps are receiving increasing interest due to their application in 3D-packages which facilitate the miniaturization of electronic devices. The reliability of microbumps during a drop event is of great concern because of their large proportion of intermetallic compounds (IMCs) which are of brittle nature. In this paper, the growth kinetics of IMCs in solder joints were analyzed. Compact mixed mode (CMM) samples with an adhesive solder joint between Cu substrates were used to simulate microbumps for evaluation of the fracture properties. The effect of IMC proportion, strain rate, and mode mixity on fracture toughness were investigated. It was found that with increasing aging, the IMC proportion increased, leading to lower fracture toughness and more brittle fracture. In addition, the fracture toughness decreased with increasing strain rate and mode mixity.","PeriodicalId":210691,"journal":{"name":"2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Effect of processing on the microstructure and fracture of solder microbumps in 3D packages\",\"authors\":\"Z. Chen, B. Talebanpour, Z. Huang, P. Kumar, I. Dutta\",\"doi\":\"10.1109/EPTC.2013.6745777\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Solder microbumps are receiving increasing interest due to their application in 3D-packages which facilitate the miniaturization of electronic devices. The reliability of microbumps during a drop event is of great concern because of their large proportion of intermetallic compounds (IMCs) which are of brittle nature. In this paper, the growth kinetics of IMCs in solder joints were analyzed. Compact mixed mode (CMM) samples with an adhesive solder joint between Cu substrates were used to simulate microbumps for evaluation of the fracture properties. The effect of IMC proportion, strain rate, and mode mixity on fracture toughness were investigated. It was found that with increasing aging, the IMC proportion increased, leading to lower fracture toughness and more brittle fracture. In addition, the fracture toughness decreased with increasing strain rate and mode mixity.\",\"PeriodicalId\":210691,\"journal\":{\"name\":\"2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013)\",\"volume\":\"12 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2013-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPTC.2013.6745777\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC.2013.6745777","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Effect of processing on the microstructure and fracture of solder microbumps in 3D packages
Solder microbumps are receiving increasing interest due to their application in 3D-packages which facilitate the miniaturization of electronic devices. The reliability of microbumps during a drop event is of great concern because of their large proportion of intermetallic compounds (IMCs) which are of brittle nature. In this paper, the growth kinetics of IMCs in solder joints were analyzed. Compact mixed mode (CMM) samples with an adhesive solder joint between Cu substrates were used to simulate microbumps for evaluation of the fracture properties. The effect of IMC proportion, strain rate, and mode mixity on fracture toughness were investigated. It was found that with increasing aging, the IMC proportion increased, leading to lower fracture toughness and more brittle fracture. In addition, the fracture toughness decreased with increasing strain rate and mode mixity.
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