{"title":"一种新型环保、无腐蚀的溶剂剥离后清洗方法","authors":"Vos, Rotondaro, Mertens, Meuris, Heyns","doi":"10.1109/VLSIT.1997.623683","DOIUrl":null,"url":null,"abstract":"Corrosion of metal lines during the post-stripping rinse is a severe problem in multi-level metallization processes. In this paper it is demonstrated that the addition of small amounts of the inorganic acid HNO3 to the ultrapure water used for rinsing can effectively be used to suppress this corrosion without the need of an additional IPA- step.","PeriodicalId":414778,"journal":{"name":"1997 Symposium on VLSI Technology","volume":"66 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-06-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"A Novel Environmentally-friendly Corrosion-free Post-stripping Rinsing Procedure After Solvent Strip\",\"authors\":\"Vos, Rotondaro, Mertens, Meuris, Heyns\",\"doi\":\"10.1109/VLSIT.1997.623683\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Corrosion of metal lines during the post-stripping rinse is a severe problem in multi-level metallization processes. In this paper it is demonstrated that the addition of small amounts of the inorganic acid HNO3 to the ultrapure water used for rinsing can effectively be used to suppress this corrosion without the need of an additional IPA- step.\",\"PeriodicalId\":414778,\"journal\":{\"name\":\"1997 Symposium on VLSI Technology\",\"volume\":\"66 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-06-10\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1997 Symposium on VLSI Technology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/VLSIT.1997.623683\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1997 Symposium on VLSI Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VLSIT.1997.623683","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A Novel Environmentally-friendly Corrosion-free Post-stripping Rinsing Procedure After Solvent Strip
Corrosion of metal lines during the post-stripping rinse is a severe problem in multi-level metallization processes. In this paper it is demonstrated that the addition of small amounts of the inorganic acid HNO3 to the ultrapure water used for rinsing can effectively be used to suppress this corrosion without the need of an additional IPA- step.