一种基于硬件的弱电阻缺陷ram中SEU监测方法

G. Pinto, G. Medeiros, F. Vargas, L. Poehls
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引用次数: 0

摘要

CMOS技术的缩放使得片上系统(SoC)晶体管密度的增加成为可能。此外,存储越来越多的信息的必要性导致静态随机存取存储器(sram)已成为SoC硅领域的重要组成部分。这种小型化带来了几个好处,其中包括系统性能的提高。然而,一些不存在的或者可以忽略不计的不良行为现在变成了现实。制造工艺的变化已经引入了新的缺陷类型,例如:(1)电阻-开放缺陷和(2)电阻-桥缺陷,这取决于它们的大小,可以导致静态或动态故障。事实上,电路对环境噪声的敏感性是与技术规模相关的另一个挑战。更详细地说,干扰会破坏电路的行为并引起单事件扰流(seu),影响电路的可靠性。鉴于这些情况,本工作提出了一种基于硬件的方法,能够检测电阻性缺陷,并在现场监测缺陷细胞,旨在检测seu。基本思想是使用引入的部分硬件来执行制造测试,以检测电路寿命期间的位翻转。请注意,只有具有弱电阻缺陷的SRAM单元被监测,因为具有传播静态故障的强缺陷的单元在制造测试后被隔离。采用商用65nm CMOS技术库建模的SRAM阵列,通过SPICE模拟验证和评估了所提出的工作。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A hardware-based approach for SEU monitoring in SRAMs with weak resistive defects
CMOS technology scaling has made the increase of transistor density in Systems-on-Chip (SoC) possible. In addition, the necessity of storing more and more information has resulted in the fact that Static Random Access Memories (SRAMs) have become great part of the SoC's silicon area. This miniaturization brings up several benefits, among them an increase of system performance. However, some undesirable behaviors, that did not exist or that were negligible, now became reality. Manufacturing process variation has introduced new types of defects, such as: (1) Resistive-Open defects and (2) Resistive-Bridge defects, which depending on their size can cause static or dynamic faults. Indeed, the circuit's sensibility to environmental noise is another challenge related to technology scaling. In more detail, the interference can damage the circuit behavior and cause Single Event Upsets (SEUs), affecting the circuit's reliability. Given these circumstances, this work proposes a hardware-based methodology able to detect resistive defects as well as to monitor defective cells in field aiming to detect SEUs. The fundamental idea is to use part of the hardware introduced to perform the manufacturing test to also detect bit-flips during the circuit's lifetime. Note that only SRAM cells with weak resistive defects are monitored, since the cells with strong defects that propagate static faults are isolated after manufacturing test. The proposed work has been validated and evaluated through SPICE simulations adopting an SRAM array modeled with a commercial 65nm CMOS technology library.
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