银修饰铜微锥与银缓冲液的低温固相键合方法

2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2017-05-01 DOI:10.23919/LTB-3D.2017.7947432

Menglong Sun, Fengtian Hu, Longlong Ju, A. Hu, Ming Li, Huiqin Ling, T. Hang

{"title":"银修饰铜微锥与银缓冲液的低温固相键合方法","authors":"Menglong Sun, Fengtian Hu, Longlong Ju, A. Hu, Ming Li, Huiqin Ling, T. Hang","doi":"10.23919/LTB-3D.2017.7947432","DOIUrl":null,"url":null,"abstract":"A novel low-temperature solid-state bonding method that Cu microcones coated with Ag and Ag buffer has been proposed. Thin Ag layer was used to prevent the oxidation of Cu microcones and Ag layer of several micrometers was used as a buffer layer between Cu microcones and Cu bumps. No brittle IMCs formed in the interfaces.","PeriodicalId":183993,"journal":{"name":"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","volume":"426 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A low-temperature solid-state bonding method using Ag-modified Cu microcones and Ag buffer\",\"authors\":\"Menglong Sun, Fengtian Hu, Longlong Ju, A. Hu, Ming Li, Huiqin Ling, T. Hang\",\"doi\":\"10.23919/LTB-3D.2017.7947432\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A novel low-temperature solid-state bonding method that Cu microcones coated with Ag and Ag buffer has been proposed. Thin Ag layer was used to prevent the oxidation of Cu microcones and Ag layer of several micrometers was used as a buffer layer between Cu microcones and Cu bumps. No brittle IMCs formed in the interfaces.\",\"PeriodicalId\":183993,\"journal\":{\"name\":\"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)\",\"volume\":\"426 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/LTB-3D.2017.7947432\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/LTB-3D.2017.7947432","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

提出了一种低温固相键合铜微锥镀银和银缓冲液的新方法。采用薄的Ag层防止Cu微锥的氧化，并采用几微米的Ag层作为Cu微锥与Cu凸块之间的缓冲层。界面未形成脆性imc。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

A low-temperature solid-state bonding method using Ag-modified Cu microcones and Ag buffer

A novel low-temperature solid-state bonding method that Cu microcones coated with Ag and Ag buffer has been proposed. Thin Ag layer was used to prevent the oxidation of Cu microcones and Ag layer of several micrometers was used as a buffer layer between Cu microcones and Cu bumps. No brittle IMCs formed in the interfaces.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

自引率

0.00%

发文量