无空隙全晶圆胶粘接

Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308) Pub Date : 2000-01-23 DOI:10.1109/MEMSYS.2000.838524

F. Niklaus, P. Enoksson, Edvard Kälvesten, G. Stemme

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引用次数: 39

摘要

在本文中，我们提出了10厘米直径的晶圆的无空隙粘接的指导方针。我们系统地研究了不同的键合参数对键中孔洞形成的影响。所测聚合物涂层的层厚在1 /spl mu/m ~ 12 /spl mu/m之间。聚合物材料、键合压力、预固化时间和预固化温度对键合中的孔隙形成有显著影响。聚合物材料特有的高粘合压力和预固化时间/温度可以抵消空隙的形成。给出了以苯并环丁烯(BCB)和光抗蚀剂涂层为粘结材料实现无空隙键的工艺参数。以BCB为键合材料，取得了良好的键合效果。

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Void-free full wafer adhesive bonding

In this paper we present guidelines for void free adhesive bonding of 10 cm diameter wafers. We have systematically investigated the influence of different bonding parameters on void formation in the bond. The layer thicknesses of the tested polymer coatings are between 1 /spl mu/m and 12 /spl mu/m. The polymer material, the bonding pressure and the pre-curing time and temperature for the polymer has shown significant influence on void formation in the bond. High bonding pressure and pre-curing times/temperatures that are specific to the polymer material counteract void formation. Process parameters for achieving void-free bonds using benzocyclobutene (BCB) and photoresist coatings as adhesive materials are given. Excellent bonding results have been achieved with BCB as bonding material.

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来源期刊

Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)

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