通过降低计算复杂度来表征导体表面粗糙度对CB-CPW行为的影响

2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems Pub Date : 2012-10-01 DOI:10.1109/EPEPS.2012.6457891

Arghya Sain, K. Melde

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引用次数: 3

摘要

本文提出了一种在三维全波模拟工具中包含导体表面粗糙度影响的方法。比较了计算负荷和衰减系数随不同粗糙表面数量和面积的变化规律。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Characterizing the impact of conductor surface roughness on CB-CPW behavior via reduced computational complexity

This paper presents a way to include the effects of conductor surface roughness in three-dimensional full wave simulation tools. A comparison of the computational load and attenuation coefficient as a function of the number and area of different surfaces roughened is given.

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来源期刊

2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems

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