{"title":"测试结构,以评估高精度金属条纹电容器阵列周围的规则虚拟装置的有用程度","authors":"H. Tuinhout, I. Brunets, A. Z. Duijnhoven","doi":"10.1109/ICMTS.2019.8730988","DOIUrl":null,"url":null,"abstract":"This paper discusses metal fringe capacitor matching test structures to characterize the impact of layer density disturbances at the edges of capacitor arrays. It is demonstrated that a seemingly minor pattern density disturbance can significantly affect the systematic mismatch in capacitor arrays up to well over 5 μm away from the array edges.","PeriodicalId":333915,"journal":{"name":"2019 IEEE 32nd International Conference on Microelectronic Test Structures (ICMTS)","volume":"41 4 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Test structure to assess the useful extent of regular dummy devices around high-precision metal fringe capacitor arrays\",\"authors\":\"H. Tuinhout, I. Brunets, A. Z. Duijnhoven\",\"doi\":\"10.1109/ICMTS.2019.8730988\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper discusses metal fringe capacitor matching test structures to characterize the impact of layer density disturbances at the edges of capacitor arrays. It is demonstrated that a seemingly minor pattern density disturbance can significantly affect the systematic mismatch in capacitor arrays up to well over 5 μm away from the array edges.\",\"PeriodicalId\":333915,\"journal\":{\"name\":\"2019 IEEE 32nd International Conference on Microelectronic Test Structures (ICMTS)\",\"volume\":\"41 4 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-03-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 IEEE 32nd International Conference on Microelectronic Test Structures (ICMTS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICMTS.2019.8730988\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE 32nd International Conference on Microelectronic Test Structures (ICMTS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMTS.2019.8730988","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Test structure to assess the useful extent of regular dummy devices around high-precision metal fringe capacitor arrays
This paper discusses metal fringe capacitor matching test structures to characterize the impact of layer density disturbances at the edges of capacitor arrays. It is demonstrated that a seemingly minor pattern density disturbance can significantly affect the systematic mismatch in capacitor arrays up to well over 5 μm away from the array edges.