VUV/O3辐照对低温SAM改性POM直接键合的影响研究

2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2017-06-13 DOI:10.23919/LTB-3D.2017.7947465

Weixin Fu, Bo Ma, H. Kuwae, S. Shoji, J. Mizuno

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引用次数: 1

摘要

采用自组装单层(SAM)作为表面修饰方法，在100℃下实现了聚氧甲基(POM)的直接键合。应用(3-氨基丙基)三乙氧基硅烷(APTES)和(3-缩水氧基丙基)三甲氧基硅烷(GOPTS)。不同VUV/O3辐照条件下的表面改性表现出不同的结合强度。此外，最高强度的结合条件平均强度为0.37 MPa。该技术有望用于微/纳米机电系统(MEMS/NMES)的封装，如生物/医疗设备。

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A study on low temperature SAM modified POM direct bonding affected by VUV/O3 irradiation

A direct bonding of polyoxymethelene (POM) was feasible at 100 °C by using self-assembled monolayers (SAM) as surface modification method. (3-Aminopropyl)triethoxysilane (APTES) and (3-Glycidyloxypropyl)trimethoxysilane (GOPTS) were applied in our work. Surface modification carried out with different VUV/O3 irradiation conditions showed different bonding strength. In addition, the bonding condition with highest strength had an average strength of 0.37 MPa. This technology was expected to be used in packaging for micro/nano electromechanical systems (MEMS/NMES), such as bio-/medical devices.

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来源期刊

2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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