晶圆级可靠性技术标准化- jedec 14.2

M. Dion
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引用次数: 1

摘要

只提供摘要形式。JEDEC代表:联合电子设备工程委员会,有时简称为“委员会”,是电子工业协会(EIA)的工程标准化机构。促进试验方法、命名法和产品特性的发展和标准化是委员会的主要职能。理事会设立委员会来开展标准化活动,每个委员会的主要职能是提出标准、程序等,并将其提交理事会采取行动或批准。可靠性由JEDEC委员会14 (JC 14)处理。"固态产品质量与可靠性委员会"顾名思义,JC 14负责制定和维护固态产品的质量和可靠性标准。目前有七个活跃的JC 14小组委员会,其中一个是JC 14.2,其范围包括生成术语,定义以及建立和/或审查与半导体器件晶圆级评估相关的规范和标准。该委员会还提供了一个论坛,讨论所有类型的晶圆级可靠性评估。大多数为晶圆级评估开发的方法、技术和标准同样适用于封装器件。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Standardization of wafer level reliability techniques-JEDEC 14.2
Summary form only given. JEDEC stands for: Joint Electronic Device Engineering Council and is sometimes known as simply "The Council", and is the engineering standardization body ofthe Electronic Industry Association (EIA). Promoting development and standardization of test methods, nomenclature and product characterization are primary functions of the Council. The Council establishes Committees to conduct its standardization activities, with the primary function of each Committee being to propose standards, procedures, etc., and submit them to the Council for action or approval. Reliability is handled by JEDEC Committee 14 (JC 14) "Committee on Quality and Reliability of Solid State Products". As its title implies JC 14 is responsible for generation and maintenance of quality and reliability standards for solid state products. Currently there are seven active JC 14 subcommittees, one of which is JC 14.2, whose scope includes generation of terms, definitions and establishment and/or review of specifications and standards relating to wafer level assessment of semiconductor devices. This committee also provides a forum for discussion of wafer level reliability assessment of all types. Most methods, techniques and standards developed for wafer level assessment work equally well with packaged devices.
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