{"title":"片上系统的CAD流程","authors":"P. Foulon","doi":"10.1109/ICM.2001.997655","DOIUrl":null,"url":null,"abstract":"The introduction of very high deep sub-micron technology introduces a lot of new problems due to the increase in complexity. In order to handle huge chips containing 40-50 millions of transistors gathered in 30-40 blocks (commonly named IPs), multi clock domains, multi powered analog blocks, routed on 6 metal layers with some wire length measuring up to 3 cm, a hierarchical approach must be set up focusing on verification and timing closure. The author considers the following aspects of the problem: timing, data structures, top-down methodology, design teams, RTL quality, logic design standardization, DFT rules, formal proof, system verification, timing block level sign-off, and physical sign-off.","PeriodicalId":360389,"journal":{"name":"ICM 2001 Proceedings. The 13th International Conference on Microelectronics.","volume":"24 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"CAD flow for system on chip\",\"authors\":\"P. Foulon\",\"doi\":\"10.1109/ICM.2001.997655\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The introduction of very high deep sub-micron technology introduces a lot of new problems due to the increase in complexity. In order to handle huge chips containing 40-50 millions of transistors gathered in 30-40 blocks (commonly named IPs), multi clock domains, multi powered analog blocks, routed on 6 metal layers with some wire length measuring up to 3 cm, a hierarchical approach must be set up focusing on verification and timing closure. The author considers the following aspects of the problem: timing, data structures, top-down methodology, design teams, RTL quality, logic design standardization, DFT rules, formal proof, system verification, timing block level sign-off, and physical sign-off.\",\"PeriodicalId\":360389,\"journal\":{\"name\":\"ICM 2001 Proceedings. The 13th International Conference on Microelectronics.\",\"volume\":\"24 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1900-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ICM 2001 Proceedings. The 13th International Conference on Microelectronics.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICM.2001.997655\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ICM 2001 Proceedings. The 13th International Conference on Microelectronics.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICM.2001.997655","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The introduction of very high deep sub-micron technology introduces a lot of new problems due to the increase in complexity. In order to handle huge chips containing 40-50 millions of transistors gathered in 30-40 blocks (commonly named IPs), multi clock domains, multi powered analog blocks, routed on 6 metal layers with some wire length measuring up to 3 cm, a hierarchical approach must be set up focusing on verification and timing closure. The author considers the following aspects of the problem: timing, data structures, top-down methodology, design teams, RTL quality, logic design standardization, DFT rules, formal proof, system verification, timing block level sign-off, and physical sign-off.