下填料用环氧/酚醛体系固化机理研究

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) Pub Date : 2001-03-11 DOI:10.1109/ISAOM.2001.916585

Zhuqing Zhang, C. Wong

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引用次数: 2

摘要

为了提高有机板上倒装芯片的可靠性，采用了下填充技术。环氧/酚醛树脂体系是一种潜在的下填料。采用差示扫描量热仪和温控傅里叶变换红外光谱仪对环氧/酚醛体系的固化机理进行了研究。研究了硬化剂、催化剂种类和催化剂浓度对固化机理的影响。发现1,8-重氮杂环[5.4.0]十一-7-烯在高温下有催化羟基内缩合反应的倾向。当树脂经历高温回流时，在无流动底填料应用中，这可能是一个潜在的问题。

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Study of curing mechanism of epoxy/phenolic system for underfill applications

Underfill technology has been adopted for high reliability in flip-chip on organic board. The epoxy/phenolic resin system is a potential candidate underfill. The curing mechanism of the epoxy/phenolic system is studied using the differential scanning calorimeter and temperature controlled Fourier transform infrared spectrometer. The effect of hardener and catalyst type and the catalyst concentration on the curing mechanism is investigated. It is found that 1,8-diazabicyclo[5.4.0]undec-7-ene has the tendency to catalyze condensation reaction within hydroxyl groups at high temperature during curing. It can be a potential concern in no-flow underfill applications when the resin undergoes high temperature reflow.

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Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562)

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