{"title":"用于集成传感器应用的微热板热建模","authors":"Darwin T. W Wong, P. Chan, L. Sheng, J. Sin","doi":"10.1109/HKEDM.1997.642353","DOIUrl":null,"url":null,"abstract":"Micromachined micro-hotplate (MHP) is used in integrated gas sensors to heat SnO/sub 2/ sensing film to the high operating temperature with milli-watts of power. This paper reports a detailed thermal modeling study of the MHP using 3-D finite element analysis. Three MHP structures were analyzed. Their thermal characteristics were compared.","PeriodicalId":262767,"journal":{"name":"1997 IEEE Hong Kong Proceedings Electron Devices Meeting","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-08-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Thermal modeling of micro-hotplates for integrated sensor applications\",\"authors\":\"Darwin T. W Wong, P. Chan, L. Sheng, J. Sin\",\"doi\":\"10.1109/HKEDM.1997.642353\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Micromachined micro-hotplate (MHP) is used in integrated gas sensors to heat SnO/sub 2/ sensing film to the high operating temperature with milli-watts of power. This paper reports a detailed thermal modeling study of the MHP using 3-D finite element analysis. Three MHP structures were analyzed. Their thermal characteristics were compared.\",\"PeriodicalId\":262767,\"journal\":{\"name\":\"1997 IEEE Hong Kong Proceedings Electron Devices Meeting\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-08-30\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1997 IEEE Hong Kong Proceedings Electron Devices Meeting\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/HKEDM.1997.642353\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1997 IEEE Hong Kong Proceedings Electron Devices Meeting","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/HKEDM.1997.642353","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Thermal modeling of micro-hotplates for integrated sensor applications
Micromachined micro-hotplate (MHP) is used in integrated gas sensors to heat SnO/sub 2/ sensing film to the high operating temperature with milli-watts of power. This paper reports a detailed thermal modeling study of the MHP using 3-D finite element analysis. Three MHP structures were analyzed. Their thermal characteristics were compared.