用于直接键合III-V/SOI混合光子器件的双锥型模式转换器

2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2017-05-01 DOI:10.23919/LTB-3D.2017.7947470

S. Inoue, Y. Hayashi, Jun-ichi Suzuki, K. Itoh, Kumi Nagasaka, N. Nishiyama, S. Arai

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引用次数: 0

摘要

提出了用于直接键合GaInAsP/SOI混合光子器件的双锥型模式转换器，并测量了采用等离子体激活键合制备的结构的特性。计算和实测结果表明，耦合效率分别为90%和75%。

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Double taper-type mode convertor for direct bonded III-V/SOI hybrid photonic devices

The double taper-type mode convertor for direct bonded GaInAsP/SOI hybrid photonic devices was proposed and the characteristics of the fabricated structure using plasma activated bonding were measured. The calculated and measured results showed the coupling efficiencies of 90% and 75%, respectively.

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2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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