{"title":"一种利用DRAM单元阵列检测极低泄漏电流的新型测试装置","authors":"T. Oasa, H. Inada, M. Fujito, T. Matsumoto","doi":"10.1109/ICMTS.1993.292879","DOIUrl":null,"url":null,"abstract":"A method for measuring very low leakage current is presented. The method, named the variable V/sub pc/ method, is capable of detecting leakage current lower than 10/sup -14/ A in the area of 8.7*9.4 mu m/sup 2/ using a dynamic RAM (DRAM) cell. This method is used to measure the leakage current caused by oxidation-induced stacking faults (OSFs) originating in a Si wafer. The leakage current of OSFs is evaluated quantitatively.<<ETX>>","PeriodicalId":123048,"journal":{"name":"ICMTS 93 Proceedings of the 1993 International Conference on Microelectronic Test Structures","volume":"70 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-03-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A new test device for detecting very low leakage current using DRAM cell array\",\"authors\":\"T. Oasa, H. Inada, M. Fujito, T. Matsumoto\",\"doi\":\"10.1109/ICMTS.1993.292879\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A method for measuring very low leakage current is presented. The method, named the variable V/sub pc/ method, is capable of detecting leakage current lower than 10/sup -14/ A in the area of 8.7*9.4 mu m/sup 2/ using a dynamic RAM (DRAM) cell. This method is used to measure the leakage current caused by oxidation-induced stacking faults (OSFs) originating in a Si wafer. The leakage current of OSFs is evaluated quantitatively.<<ETX>>\",\"PeriodicalId\":123048,\"journal\":{\"name\":\"ICMTS 93 Proceedings of the 1993 International Conference on Microelectronic Test Structures\",\"volume\":\"70 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1993-03-22\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ICMTS 93 Proceedings of the 1993 International Conference on Microelectronic Test Structures\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICMTS.1993.292879\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ICMTS 93 Proceedings of the 1993 International Conference on Microelectronic Test Structures","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMTS.1993.292879","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A new test device for detecting very low leakage current using DRAM cell array
A method for measuring very low leakage current is presented. The method, named the variable V/sub pc/ method, is capable of detecting leakage current lower than 10/sup -14/ A in the area of 8.7*9.4 mu m/sup 2/ using a dynamic RAM (DRAM) cell. This method is used to measure the leakage current caused by oxidation-induced stacking faults (OSFs) originating in a Si wafer. The leakage current of OSFs is evaluated quantitatively.<>