创新光学与电子互连印刷电路板制造研究

David R. Selviah, D. Hutt, A. Walker, K. Wang, F. Fernández, P. Conway, D. Milward, I. Papakonstantinou, H. Baghsiahi, J. Chappell, S. S. Zakariyah, A. Mccarthy, H. Suyal
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引用次数: 12

摘要

这项耗资130万英镑的创新电子制造研究中心(IeMRC)旗舰项目由3所英国大学和10家名为“集成光学和电子互连PCB制造现状”的公司资助。该项目旨在开发光波导设计规则、布局软件、与商业生产兼容的制造方法、表征技术和光连接器设计,为用于10gb /s板对板互连的聚合物多模光波导印刷电路板(OPCB)提供供应链。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Innovative Optical and Electronic Interconnect Printed Circuit Board Manufacturing research
An overview of the pound1.3 million EPSRC and company matched funded Innovative electronics Manufacturing Research Centre (IeMRC) Flagship project between 3 UK universities and 10 companies entitled ldquointegrated optical and electronic interconnect PCB manufacturingrdquo. The project aims to develop of optical waveguide design rules, layout software, fabrication methods compatible with commercial production, characterisation techniques and optical connector design to provide a supply chain for Polymer Multimode Optical Waveguide Printed Circuit Boards (OPCB) for 10 Gb/s board-to-board interconnections.
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