R. Ritzenthaler, F. Lime, M. Ricoma, F. Martinez, O. Faynot, F. Pascal, M. Valenza, E. Miranda, S. Cristoloveanu, B. Iñíguez
{"title":"平面和三栅极SOI晶体管的寄生后界面传导","authors":"R. Ritzenthaler, F. Lime, M. Ricoma, F. Martinez, O. Faynot, F. Pascal, M. Valenza, E. Miranda, S. Cristoloveanu, B. Iñíguez","doi":"10.1109/SOI.2010.5641386","DOIUrl":null,"url":null,"abstract":"Using a compact model derived for long channels ΠFET, TGFETs and planar FDSOI transistors, it is demonstrated that experimental fully depleted devices can operate in the “back-interface inversion” regime even at VG2 grounded. As a result, two threshold voltages appear in the transistors, with an experimental difference of threshold voltages up to several hundreds mV for planar FDSOI devices. As a consequence, the back-interface channel is activated, leading to off-state current increase and subthreshold slope degradation. This effect can be alleviated by keeping a thick BOX when scaling down the structures, or by using vertical Multiple-GateFETs.","PeriodicalId":227302,"journal":{"name":"2010 IEEE International SOI Conference (SOI)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-11-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Parasitic back-inferface conduction in planar and triple-gate SOI transistors\",\"authors\":\"R. Ritzenthaler, F. Lime, M. Ricoma, F. Martinez, O. Faynot, F. Pascal, M. Valenza, E. Miranda, S. Cristoloveanu, B. Iñíguez\",\"doi\":\"10.1109/SOI.2010.5641386\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Using a compact model derived for long channels ΠFET, TGFETs and planar FDSOI transistors, it is demonstrated that experimental fully depleted devices can operate in the “back-interface inversion” regime even at VG2 grounded. As a result, two threshold voltages appear in the transistors, with an experimental difference of threshold voltages up to several hundreds mV for planar FDSOI devices. As a consequence, the back-interface channel is activated, leading to off-state current increase and subthreshold slope degradation. This effect can be alleviated by keeping a thick BOX when scaling down the structures, or by using vertical Multiple-GateFETs.\",\"PeriodicalId\":227302,\"journal\":{\"name\":\"2010 IEEE International SOI Conference (SOI)\",\"volume\":\"3 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2010-11-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2010 IEEE International SOI Conference (SOI)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SOI.2010.5641386\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2010 IEEE International SOI Conference (SOI)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SOI.2010.5641386","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Parasitic back-inferface conduction in planar and triple-gate SOI transistors
Using a compact model derived for long channels ΠFET, TGFETs and planar FDSOI transistors, it is demonstrated that experimental fully depleted devices can operate in the “back-interface inversion” regime even at VG2 grounded. As a result, two threshold voltages appear in the transistors, with an experimental difference of threshold voltages up to several hundreds mV for planar FDSOI devices. As a consequence, the back-interface channel is activated, leading to off-state current increase and subthreshold slope degradation. This effect can be alleviated by keeping a thick BOX when scaling down the structures, or by using vertical Multiple-GateFETs.