用于BAW器件的3D堆叠封装解决方案:3D封装演示和射频性能

2011 Proceedings of the European Solid-State Device Research Conference (ESSDERC) Pub Date : 2011-10-13 DOI:10.1109/ESSDERC.2011.6044218

X. Sun, G. Posada, B. Majeed, W. Zhang, W. De Raedt, C. Diekmann, C. Eggs, E. Schmidhammer

{"title":"用于BAW器件的3D堆叠封装解决方案:3D封装演示和射频性能","authors":"X. Sun, G. Posada, B. Majeed, W. Zhang, W. De Raedt, C. Diekmann, C. Eggs, E. Schmidhammer","doi":"10.1109/ESSDERC.2011.6044218","DOIUrl":null,"url":null,"abstract":"This paper presents a 3D integration concept as a solution to package FBAR or BAW devices providing at the same time additional RF functionality. The feasibility of this 3D packaging solution has been proven by the successful realization of a 3D packaging demonstration vehicle including FBAR device, solder ring, bumps, through substrate via, low loss interconnects and extra integrated RF functionality. A good RF performance has been obtained. This concept could also be used for the packaging of MEMS, since the requirements are similar.","PeriodicalId":161896,"journal":{"name":"2011 Proceedings of the European Solid-State Device Research Conference (ESSDERC)","volume":"21 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2011-10-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"3D stack packaging solution for BAW devices: 3D packaging demonstrator and RF performance\",\"authors\":\"X. Sun, G. Posada, B. Majeed, W. Zhang, W. De Raedt, C. Diekmann, C. Eggs, E. Schmidhammer\",\"doi\":\"10.1109/ESSDERC.2011.6044218\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents a 3D integration concept as a solution to package FBAR or BAW devices providing at the same time additional RF functionality. The feasibility of this 3D packaging solution has been proven by the successful realization of a 3D packaging demonstration vehicle including FBAR device, solder ring, bumps, through substrate via, low loss interconnects and extra integrated RF functionality. A good RF performance has been obtained. This concept could also be used for the packaging of MEMS, since the requirements are similar.\",\"PeriodicalId\":161896,\"journal\":{\"name\":\"2011 Proceedings of the European Solid-State Device Research Conference (ESSDERC)\",\"volume\":\"21 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2011-10-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2011 Proceedings of the European Solid-State Device Research Conference (ESSDERC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ESSDERC.2011.6044218\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 Proceedings of the European Solid-State Device Research Conference (ESSDERC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESSDERC.2011.6044218","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

本文提出了一个3D集成概念，作为封装FBAR或BAW设备的解决方案，同时提供额外的射频功能。该3D封装解决方案的可行性已被成功实现的3D封装演示车辆所证明，该演示车辆包括FBAR器件、焊环、凸点、通过基板、低损耗互连和额外的集成射频功能。获得了良好的射频性能。这个概念也可以用于MEMS的封装，因为要求是相似的。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

3D stack packaging solution for BAW devices: 3D packaging demonstrator and RF performance

This paper presents a 3D integration concept as a solution to package FBAR or BAW devices providing at the same time additional RF functionality. The feasibility of this 3D packaging solution has been proven by the successful realization of a 3D packaging demonstration vehicle including FBAR device, solder ring, bumps, through substrate via, low loss interconnects and extra integrated RF functionality. A good RF performance has been obtained. This concept could also be used for the packaging of MEMS, since the requirements are similar.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2011 Proceedings of the European Solid-State Device Research Conference (ESSDERC)

自引率

0.00%

发文量