电源集成模块的失效分析及其挑战

2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Pub Date : 2016-07-18 DOI:10.1109/IPFA.2016.7564325

E. J. de La Cruz, N. Yusof, W. Y. Wong, N. I. Mohd Arifen

{"title":"电源集成模块的失效分析及其挑战","authors":"E. J. de La Cruz, N. Yusof, W. Y. Wong, N. I. Mohd Arifen","doi":"10.1109/IPFA.2016.7564325","DOIUrl":null,"url":null,"abstract":"Power Integrated Module (PIM) in a configurable package platform employs high-power direct-bonded-copper (DBC) substrate technology along with press-fit pins, thus, provides a high performance and reliable power module solution. The state of the art module platform however, presents a challenge to perform component-level failure analysis. The failure analysis techniques developed for multi-layered module packaging is presented in this paper.","PeriodicalId":206237,"journal":{"name":"2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"45 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-07-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Failure analysis of power integrated modules and its challenges\",\"authors\":\"E. J. de La Cruz, N. Yusof, W. Y. Wong, N. I. Mohd Arifen\",\"doi\":\"10.1109/IPFA.2016.7564325\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Power Integrated Module (PIM) in a configurable package platform employs high-power direct-bonded-copper (DBC) substrate technology along with press-fit pins, thus, provides a high performance and reliable power module solution. The state of the art module platform however, presents a challenge to perform component-level failure analysis. The failure analysis techniques developed for multi-layered module packaging is presented in this paper.\",\"PeriodicalId\":206237,\"journal\":{\"name\":\"2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"volume\":\"45 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-07-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA.2016.7564325\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2016.7564325","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 2

摘要

可配置封装平台中的电源集成模块(PIM)采用大功率直接键合铜(DBC)基板技术以及压合引脚，从而提供了高性能和可靠的电源模块解决方案。然而，先进的模块平台对执行组件级故障分析提出了挑战。本文介绍了多层模块封装的失效分析技术。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Failure analysis of power integrated modules and its challenges

Power Integrated Module (PIM) in a configurable package platform employs high-power direct-bonded-copper (DBC) substrate technology along with press-fit pins, thus, provides a high performance and reliable power module solution. The state of the art module platform however, presents a challenge to perform component-level failure analysis. The failure analysis techniques developed for multi-layered module packaging is presented in this paper.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

自引率

0.00%

发文量