Yang Xu, Shengkai Wang, Yinghui Wang, Dapeng Chen, Zhi Jin, Xinyu Liu
{"title":"一种采用点压粘接技术的改进水玻璃胶粘接方法","authors":"Yang Xu, Shengkai Wang, Yinghui Wang, Dapeng Chen, Zhi Jin, Xinyu Liu","doi":"10.23919/LTB-3D.2017.7947435","DOIUrl":null,"url":null,"abstract":"A modified water glass adhesive bonding method using spot pressing bonding technique (SPB) is proposed. The mechanism of water glass bonding is investigated, and the voids formation has been discussed. The combined method achieved low temperature adhesive bonding and minimized the influence of water molecules to bonding interface.","PeriodicalId":183993,"journal":{"name":"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","volume":"IA-15 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"A modified water glass adhesive bonding method using spot pressing bonding technique\",\"authors\":\"Yang Xu, Shengkai Wang, Yinghui Wang, Dapeng Chen, Zhi Jin, Xinyu Liu\",\"doi\":\"10.23919/LTB-3D.2017.7947435\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A modified water glass adhesive bonding method using spot pressing bonding technique (SPB) is proposed. The mechanism of water glass bonding is investigated, and the voids formation has been discussed. The combined method achieved low temperature adhesive bonding and minimized the influence of water molecules to bonding interface.\",\"PeriodicalId\":183993,\"journal\":{\"name\":\"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)\",\"volume\":\"IA-15 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/LTB-3D.2017.7947435\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/LTB-3D.2017.7947435","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A modified water glass adhesive bonding method using spot pressing bonding technique
A modified water glass adhesive bonding method using spot pressing bonding technique (SPB) is proposed. The mechanism of water glass bonding is investigated, and the voids formation has been discussed. The combined method achieved low temperature adhesive bonding and minimized the influence of water molecules to bonding interface.