通过高分辨率测量优化临时键合，实现超薄晶圆处理

2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) Pub Date : 2012-12-01 DOI:10.1109/EPTC.2012.6507100

Alvin Lee, Jay Su, J. McCutcheon, B. Wang, L. Tsai, A. Shorey

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引用次数: 6

摘要

为了实现三维系统集成，人们对薄晶片处理的临时晶圆键合技术越来越感兴趣。临时粘合剂的热稳定性、工艺兼容性和耐化学性等几个挑战已经在许多出版物中得到解决。然而，由于计量的限制，很少讨论载流子、临时粘合剂、临时粘接和最终减薄厚度之间的厚度变化的相关性。本文描述的工作使用了来自Brewer Science, Inc.的WaferBOND®高级粘合材料和ZoneBOND®[1]技术，以及来自康宁公司的Tropel®FlatMaster®MSP-300和半导体玻璃晶圆来评估每层的影响和适当的计量方法，以提高整体性能。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Optimization of temporary bonding through high-resolution metrologies to realize ultrathin wafer handling

Interest has intensified in temporary wafer bonding technology for thin wafer handling to realize 3D system integration. Several challenges such as thermal stability, process compatibility, and chemical resistance for temporary adhesives have been addressed in numerous publications. However, the correlation of thickness variation among carrier, temporary adhesive, temporary bonding, and final thinning thickness is rarely discussed because of limitations in metrology. The work described here utilized a WaferBOND® advanced bonding material and ZoneBOND® [1] technology from Brewer Science, Inc., as well as the Tropel® FlatMaster® MSP-300 and semiconductor glass wafers from Corning Incorporated to evaluate the influence of each layer and suitable metrology to enhance overall performance.

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来源期刊

2012 IEEE 14th Electronics Packaging Technology Conference (EPTC)

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