硅微电子的未来

S. Hillenius
{"title":"硅微电子的未来","authors":"S. Hillenius","doi":"10.1109/WMED.2004.1297335","DOIUrl":null,"url":null,"abstract":"The silicon microelectronic industry has gone through exponential growth in applications, complexity, density, and cost of manufacturing over the last several decades. The challenges in device physics for scaling transistors as well as the design challenges and economic challenges are reviewed and described in the context of how these forces are shaping the way we do business.","PeriodicalId":296968,"journal":{"name":"2004 IEEE Workshop on Microelectronics and Electron Devices","volume":"37 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-09-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"The future of silicon microelectronics\",\"authors\":\"S. Hillenius\",\"doi\":\"10.1109/WMED.2004.1297335\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The silicon microelectronic industry has gone through exponential growth in applications, complexity, density, and cost of manufacturing over the last several decades. The challenges in device physics for scaling transistors as well as the design challenges and economic challenges are reviewed and described in the context of how these forces are shaping the way we do business.\",\"PeriodicalId\":296968,\"journal\":{\"name\":\"2004 IEEE Workshop on Microelectronics and Electron Devices\",\"volume\":\"37 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2004-09-27\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2004 IEEE Workshop on Microelectronics and Electron Devices\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/WMED.2004.1297335\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2004 IEEE Workshop on Microelectronics and Electron Devices","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/WMED.2004.1297335","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4

摘要

在过去的几十年里,硅微电子工业在应用、复杂性、密度和制造成本方面都经历了指数级增长。在这些力量如何塑造我们开展业务的方式的背景下,回顾和描述了缩放晶体管的器件物理挑战以及设计挑战和经济挑战。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
The future of silicon microelectronics
The silicon microelectronic industry has gone through exponential growth in applications, complexity, density, and cost of manufacturing over the last several decades. The challenges in device physics for scaling transistors as well as the design challenges and economic challenges are reviewed and described in the context of how these forces are shaping the way we do business.
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