H. Hanahata, M. Miyamoto, T. Kamata, S. Matsuno, T. Tanabe
{"title":"多孔二氧化硅ILD薄膜基本性能对CMP相容性影响的初步研究","authors":"H. Hanahata, M. Miyamoto, T. Kamata, S. Matsuno, T. Tanabe","doi":"10.1109/IITC.2000.854282","DOIUrl":null,"url":null,"abstract":"Adhesion, cohesive strength, modulus, and hardness of the porous silica ILD film via organic/inorganic hybrid (ALCAP-S) with various kinds of film thickness were investigated and the preliminary attempt was made to correlate the above properties with abrasion compatibility as a function of film thickness. The Stud-pull strength is drastically affected by the visco-elastic behavior of the film and necessary for correction. The corrected adhesion and cohesive strength of ALCAP-S (k=2.2) are satisfactorily high. With decreasing the film thickness, the depth-dependency of modulus induced by the substrate becomes more significant and the corresponding film is liable to abrasion. On the contrary, with increasing thickness the dependency ceases and the film appears to be more elastic, leading to lower abrasion compatibility.","PeriodicalId":287825,"journal":{"name":"Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407)","volume":"11 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Preliminary study on dependency of basic properties of porous silica ILD thin film on CMP compatibility\",\"authors\":\"H. Hanahata, M. Miyamoto, T. Kamata, S. Matsuno, T. Tanabe\",\"doi\":\"10.1109/IITC.2000.854282\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Adhesion, cohesive strength, modulus, and hardness of the porous silica ILD film via organic/inorganic hybrid (ALCAP-S) with various kinds of film thickness were investigated and the preliminary attempt was made to correlate the above properties with abrasion compatibility as a function of film thickness. The Stud-pull strength is drastically affected by the visco-elastic behavior of the film and necessary for correction. The corrected adhesion and cohesive strength of ALCAP-S (k=2.2) are satisfactorily high. With decreasing the film thickness, the depth-dependency of modulus induced by the substrate becomes more significant and the corresponding film is liable to abrasion. On the contrary, with increasing thickness the dependency ceases and the film appears to be more elastic, leading to lower abrasion compatibility.\",\"PeriodicalId\":287825,\"journal\":{\"name\":\"Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407)\",\"volume\":\"11 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1900-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IITC.2000.854282\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IITC.2000.854282","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Preliminary study on dependency of basic properties of porous silica ILD thin film on CMP compatibility
Adhesion, cohesive strength, modulus, and hardness of the porous silica ILD film via organic/inorganic hybrid (ALCAP-S) with various kinds of film thickness were investigated and the preliminary attempt was made to correlate the above properties with abrasion compatibility as a function of film thickness. The Stud-pull strength is drastically affected by the visco-elastic behavior of the film and necessary for correction. The corrected adhesion and cohesive strength of ALCAP-S (k=2.2) are satisfactorily high. With decreasing the film thickness, the depth-dependency of modulus induced by the substrate becomes more significant and the corresponding film is liable to abrasion. On the contrary, with increasing thickness the dependency ceases and the film appears to be more elastic, leading to lower abrasion compatibility.