创新故障隔离分析技术，识别故障机理，恢复设备故障

2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Pub Date : 2016-07-18 DOI:10.1109/IPFA.2016.7564320

Izhar Helmi Ahmad, Anton Van Alferez, Y. M. Yusof

{"title":"创新故障隔离分析技术，识别故障机理，恢复设备故障","authors":"Izhar Helmi Ahmad, Anton Van Alferez, Y. M. Yusof","doi":"10.1109/IPFA.2016.7564320","DOIUrl":null,"url":null,"abstract":"Failure analysis (FA) plays an important role in the semiconductor industry as the process technology and new packaging is continuously improved. Missed out failure mechanisms and device recovery is a growing challenge in the FA field. In this paper, a new FA method is presented. A precise backside Fault Isolation was utilized in combination with Cross-section and Focused Ion Beam to uncover the Failure mechanism. The application of this method will be discussed on two case studies with different failure mechanisms.","PeriodicalId":206237,"journal":{"name":"2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-07-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Innovative fault isolation analysis technique to identify failure mechanism on recovering device failure\",\"authors\":\"Izhar Helmi Ahmad, Anton Van Alferez, Y. M. Yusof\",\"doi\":\"10.1109/IPFA.2016.7564320\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Failure analysis (FA) plays an important role in the semiconductor industry as the process technology and new packaging is continuously improved. Missed out failure mechanisms and device recovery is a growing challenge in the FA field. In this paper, a new FA method is presented. A precise backside Fault Isolation was utilized in combination with Cross-section and Focused Ion Beam to uncover the Failure mechanism. The application of this method will be discussed on two case studies with different failure mechanisms.\",\"PeriodicalId\":206237,\"journal\":{\"name\":\"2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"volume\":\"4 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-07-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA.2016.7564320\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2016.7564320","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

随着工艺技术和新型封装技术的不断进步，失效分析在半导体工业中发挥着越来越重要的作用。漏失故障机制和设备恢复是故障分析领域面临的一个日益严峻的挑战。本文提出了一种新的FA方法。结合横截面和聚焦离子束，采用精确的背面故障隔离技术来揭示故障机制。该方法的应用将在两个具有不同失效机制的案例研究中进行讨论。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Innovative fault isolation analysis technique to identify failure mechanism on recovering device failure

Failure analysis (FA) plays an important role in the semiconductor industry as the process technology and new packaging is continuously improved. Missed out failure mechanisms and device recovery is a growing challenge in the FA field. In this paper, a new FA method is presented. A precise backside Fault Isolation was utilized in combination with Cross-section and Focused Ion Beam to uncover the Failure mechanism. The application of this method will be discussed on two case studies with different failure mechanisms.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

自引率

0.00%

发文量