简化LED温度预测方法的基础研究

Akira Horii, T. Hatakeyama, R. Kibushi, M. Ishizuka
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引用次数: 2

摘要

近年来,LED作为一种新型光源备受关注。LED灯泡是LED的一种用途,它可以替代传统的室内照明,如白炽灯和荧光灯。与其他光源相比,LED灯泡具有寿命长、功耗低等优点。然而,LED芯片体积小,单位面积的发热量越来越大。这会导致LED芯片因高温而退化。因此,散热设计对LED灯泡和其他LED器件非常重要。LED的热设计必须考虑各种参数,例如导热系数,LED衬底的面积和厚度以及LED周围的传热系数。然而,对于LED的热设计没有指导方针,LED的可靠性取决于热设计师。本工作旨在提出LED散热设计的指导原则。在本文中,作为指南的第一步,讨论了简单的LED温度预测方法。采用热网络模型作为简单方法。为了验证一种适合的简单的用热网模型进行温度预测的方法,进行了CFD (Computational Fluid Dynamics)分析,并讨论了建立热网模型的要点。结果表明,如何同时估计衬底平面内方向和厚度平面方向的热流是建立简单的LED温度预测模型的关键。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Fundamental study on simplified temperature prediction method for LED
In recent years, LED is attracted attention as new light sources. LED bulb is one of the LED usages and this is a replacement for conventional indoor lighting such as incandescent light bulbs and fluorescent lamps. LED bulbs have advantages such as long life and low power consumption compared to other light sources. However volume of LED chip is small and the amount of heat generation per area is becoming large. That causes degradation of LED chips because of high temperature. Therefore, thermal design is important for LED bulbs and other LED devices. The thermal design of the LED must take into account various parameters, for example thermal conductivity, area and thickness of the substrate of the LED and heat transfer coefficient around the LED. However, there are no guidelines for thermal design of the LED, and reliability of the LED is depending on thermal designers. This work aims to propose a guideline of thermal design of the LED. In this paper, as the first step of the guideline, simple temperature prediction method for the LED was discussed. Thermal network model was employed as the simple method. To verify an appropriate simple temperature prediction method with thermal network model, CFD (Computational Fluid Dynamics) analysis was conducted and important points for making thermal network model are discussed. As a result, it was found that a key point for making a simple temperature prediction model of the LED is how to estimate the heat flow in in-plane direction and thickness plane direction of the substrate simultaneously.
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