集成电路封装技术热特性测试芯片和测试系统的开发和应用

[1992 Proceedings] Eighth Annual IEEE Semiconductor Thermal Measurement and Management Symposium Pub Date : 1992-02-03 DOI:10.1109/STHERM.1992.172867

S. Mathúna, Liu Daguang

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引用次数: 13

摘要

作者报告了测试芯片和计算机测试系统的开发和应用，用于IC封装技术的稳态和瞬态热特性。本文讨论了稳态测试系统的温度传感器校准算法和在烘箱环境下结壳热阻测量的误差预算。基于烘箱的结壳热阻测试方法的准确度和重复性分别为+or-18%和+or-4%。通过与红外热成像的比较，表明使用平均结温可以为传统IC封装结构提供准确的热阻图

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Development and application of test chips and test systems for the thermal characteristics of IC packaging technologies

The authors report on the development and application of test chips and computerized test systems for the steady state and transient thermal characterization of IC packaging technologies. The steady state test system is discussed in terms of the temperature sensor calibration algorithm and the error budget associated with junction-to-case thermal resistance measurements in an oven environment. Accuracy and repeatability figures of +or-18% and +or-4% respectively have been obtained for an oven-based junction-to-case thermal resistance test method. By a comparison with infrared thermal imaging, the use of the average junction temperature is shown to provide an accurate thermal resistance figure for conventional IC package structures.<>

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[1992 Proceedings] Eighth Annual IEEE Semiconductor Thermal Measurement and Management Symposium

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