C. Adelmann, J. Soulie, J. Scheerder, C. Fleischmann, K. Sankaran, G. Pourtois, J. Swerts, Z. Tokei
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Intermetallic Compounds as Alternatives to Copper for Advanced Interconnect Metallization
Recently, the search for alternative metallization schemes beyond Cu has been extended from elemental metals to binary and ternary intermetallics. Here, we review our material selection process for binary intermetallic compounds and discuss the additional complexities to understand the transport in such metals with respect to elemental metals. A simple but practical resistance model for binary compounds is proposed by extending the Mayadas-Shatzkes model for ordered intermetallics.
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