汽车用钯饰面的纯银线粘接

Riccardo Villa, N. Hashim, Darwin BINI, Ivana Favretto
{"title":"汽车用钯饰面的纯银线粘接","authors":"Riccardo Villa, N. Hashim, Darwin BINI, Ivana Favretto","doi":"10.1109/EPTC47984.2019.9026677","DOIUrl":null,"url":null,"abstract":"Material selection in wire bonding requires the best match of electrical characteristics, mechanical properties and material cost to reach high performance and competitiveness in automotive market. Silver alloy is emerging to replace gold and copper thanks to its softness, however it reveals high resistivity when bigger wire diameter is needed for high current applications. The aim of this work is to introduce pure silver wire bonding on palladium finished pads as new alternative able to combine low electrical resistivity and excellent reliability performance. For this purpose, process capability and reliability tests outcome are reported to characterize the new material during product operating life.","PeriodicalId":244618,"journal":{"name":"2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Pure silver wire bonding on palladium finishing for automotive application\",\"authors\":\"Riccardo Villa, N. Hashim, Darwin BINI, Ivana Favretto\",\"doi\":\"10.1109/EPTC47984.2019.9026677\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Material selection in wire bonding requires the best match of electrical characteristics, mechanical properties and material cost to reach high performance and competitiveness in automotive market. Silver alloy is emerging to replace gold and copper thanks to its softness, however it reveals high resistivity when bigger wire diameter is needed for high current applications. The aim of this work is to introduce pure silver wire bonding on palladium finished pads as new alternative able to combine low electrical resistivity and excellent reliability performance. For this purpose, process capability and reliability tests outcome are reported to characterize the new material during product operating life.\",\"PeriodicalId\":244618,\"journal\":{\"name\":\"2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)\",\"volume\":\"17 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPTC47984.2019.9026677\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC47984.2019.9026677","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

线接材料的选择需要电气特性、机械性能和材料成本的最佳匹配,以达到汽车市场的高性能和竞争力。由于银合金的柔软性,它正在取代金和铜,但在大电流应用中需要更大的线径时,它的电阻率很高。这项工作的目的是将纯银线结合在钯焊盘上,作为一种新的选择,能够结合低电阻率和优异的可靠性性能。为此,报告了工艺能力和可靠性测试结果,以在产品使用寿命期间表征新材料。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Pure silver wire bonding on palladium finishing for automotive application
Material selection in wire bonding requires the best match of electrical characteristics, mechanical properties and material cost to reach high performance and competitiveness in automotive market. Silver alloy is emerging to replace gold and copper thanks to its softness, however it reveals high resistivity when bigger wire diameter is needed for high current applications. The aim of this work is to introduce pure silver wire bonding on palladium finished pads as new alternative able to combine low electrical resistivity and excellent reliability performance. For this purpose, process capability and reliability tests outcome are reported to characterize the new material during product operating life.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信