反向EB应力和混合模应力对正、逆模SiGe HBTs低频噪声的影响

Jin Tang, Jonggook Kim, J. Babcock, A. Sadovnikov, T. Krakowski
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引用次数: 2

摘要

在这项工作中,我们提出了电气可靠性应力对SiGe HBTs在正向和反向模式下的低频噪声的影响。研究了反向电子束应力和正向混合模态应力。本文首次将逆模态噪声作为研究应力损伤的工具。反向EB应力在正向模式下降低了SiGe HBTs的低频噪声,而在反向模式下则没有,这表明应力诱导的圈闭位于EB间隔氧化物中。混合模应力降低了正反模低频噪声,这与在应力过程中EB结和CB结都被破坏的理论一致。观察到的应力作用下的噪声退化要求在可靠性仿真中建立准确的噪声老化模型。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Impact of reverse EB stress and mixed-mode stress on low-frequency noise for SiGe HBTs in forward and inverse modes
We present in this work the impact of electrical reliability stress on low-frequency noise for SiGe HBTs in forward and inverse modes. The reverse EB stress and the forward mixed-mode stress are investigated. For the first time inverse mode noise is used as a tool to investigate stress-induced damage. The fact that reverse EB stress degrades SiGe HBTs low-frequency noise in the forward mode but not in the inverse mode indicates that the stress-induced traps are located in the EB spacer oxide. Mixed-mode stress degrades both the forward and inverse modes low-frequency noise, consistent with the theory that both the EB and CB junctions are damaged during the stress. The observed noise degradation under stress calls for accurate noise aging modeling in reliability simulation.
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