基于金刚石自旋量子比特的模块化量子计算机三维集成

R. Ishihara, J. Hermias, S. Neji, K. Yu, M. van der Maas, S. Nur, T. Iwai, T. Miyatake, S. Miyahara, K. Kawaguchi, S. Sato
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引用次数: 0

摘要

基于钻石自旋量子位的量子计算机芯片使用了与片内光学链路纠缠的模块。当芯片上的量子比特数量增加时,这使得连接性增加,串扰和错误率可以忽略不计。在这里,3D集成是金刚石自旋量子比特与光子和电子电路大规模集成的关键使能技术,用于量子比特的路由、控制和读出。将金刚石中的大量自旋与在低温下工作的片上电路集成在一起存在一些工程挑战。在本文中,我们将解决挑战,介绍最近的结果,并讨论实现基于金刚石自旋量子比特的可扩展量子计算机的集成技术的未来前景。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
3D Integration for Modular Quantum Computer based on Diamond Spin Qubits
Quantum computer chip based on spin qubits in diamond uses modules that are entangled with on-chip optical links. This enables an increased connectivity and a negligible crosstalk and error-rate when the number of qubits increases onchip. Here, 3D integration is the key enabling technology for a large-scale integration of the diamond spin qubits with photonic and electronic circuits for routing, control and readout of qubits. There are several engineering challenges to integrate the large number of spins in diamond with the on-chip circuits operating at a cryogenic temperature. In this paper we will address challenges, present recent results and discuss future outlook of the integration technology for realization of a scalable quantum computer based on diamond spin qubits.
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