高质量独立式GaN衬底及其在高击穿电压GaN p-n二极管中的应用

H. Ohta, Tohru Nakamura, T. Mishima
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引用次数: 5

摘要

GaN独立式衬底的最新发展使高性能垂直结构GaN器件的制造成为可能。本文回顾了高质量GaN衬底的制造方法,并报道了在衬底上制造的垂直GaN p-n二极管的击穿电压增加。通过在p-n二极管上施加多个轻Si掺杂的n-GaN漂移层,实现了创纪录的4.7 kV击穿电压(VB)和1.7 mΩcm2的低比差分导通电阻(Ron)。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
High quality free-standing GaN substrates and their application to high breakdown voltage GaN p-n diodes
Recent development in GaN free-standing substrates have enabled fabrications of high performance vertical structure GaN devices. This letter reviews fabrication method of the high quality GaN substrates and reports increased breakdown voltages in vertical GaN p-n diodes fabricated on the substrates. By applying multiple lightly Si doped n-GaN drift layers to the p-n diode, record breakdown voltages (VB) of 4.7 kV combined with low specific differential on-resistance (Ron) of 1.7 mΩcm2 were achieved.
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