一种低温生物化学相容性键合技术，用于生物化学微流控系统

Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308) Pub Date : 2000-01-23 DOI:10.1109/MEMSYS.2000.838553

A. Han, K. Oh, S. Bhansali, H. Thurman Henderson, C. Ahn

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引用次数: 44

摘要

本研究开发了一种新型的含氟聚合物低温生物化学相容性键合技术，并在机械键合强度和生物化学抗性方面进行了表征。这种键合技术使用自旋聚四氟乙烯样无定形氟碳聚合物(CYTOP/sup TM/)作为键合界面层。所开发的键合工艺要求键合温度为160/spl℃，硅对硅的键合强度为4.3 Mpa。此外，该键合技术在各种基质上实现了可靠和防漏的键合，并为某些特定的免疫分析提供了出色的耐化学性和生物相容性。本工作所开发的键合技术已成功地应用于表面贴装微流控元件的微流控主板系统的开发。

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A low temperature biochemically compatible bonding technique using fluoropolymers for biochemical microfluidic systems

A new low temperature biochemically compatible bonding technique using fluoropolymers has been developed in this work and characterized in terms of mechanical bonding strength and biochemical resistance. This bonding technique uses a spin-on Teflon-like amorphous fluorocarbon polymer (CYTOP/sup TM/) as a bonding interface layer. The developed bonding process requires a bonding temperature of 160/spl deg/C and the bonding strength attained from the process shows 4.3 Mpa in silicon-to-silicon. Furthermore, the bonding technique achieves reliable and leak-proof bonding in various substrates and provides excellent chemical resistance and biocompatibility for some specific immunoassays. The bonding technique developed in this work has been successfully applied to the development of a microfluidic motherboard system with surface mountable microfluidic components.

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Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)

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