用表面活化键合法评价Al箔/AlN结的键合强度

2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2019-05-21 DOI:10.23919/LTB-3D.2019.8735417

Shota Horikawa, S. Morita, Jianbo Liang, Y. Kaneko, Y. Nishio, M. Matsubara, H. Asahi, N. Shigekawa

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引用次数: 2

摘要

在室温和473 K条件下，将30 μm Al箔与650 μm AlN板结合，制备了Al箔/AlN结。通过180°剥离试验，他们的结合强度估计分别为~30和~60 N/m，分别用于室温和473-K键合。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Bonding strength evaluation of Al foil/AlN junctions by surface activated bonding

An Al foil/AlN junction is fabricated by bonding a 30-μm Al foil and a 650-μm AlN plate at room temperature and 473 K. Their bonding strength, which is measured by the 180° peel test, is estimated to be ~30 and ~60 N/m for junctions fabricated by the room-temperature and 473-K bonding, respectively.

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来源期刊

2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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