SiOC:H薄膜中高场应力的电探测磁共振研究

F. Sharov, S. Moxim, M. J. Elko, S. King, P. Lenahan
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引用次数: 0

摘要

我们研究了高场应力低k介电介质(SiOC:H)电容器结构中介电击穿的初始阶段。我们的研究利用电检测磁共振(EDMR)通过自旋依赖阱辅助隧道(SDTAT)。我们发现介电介质击穿之前至少有两个不同的阶段:一个非常快的初始阶段,与泄漏电流的总体减少和硅悬空键的快速产生有关;一个非常慢的后续中间阶段,与泄漏电流的总体恢复有关,几乎没有进一步的硅悬空键陷阱产生。这些Si悬空键在器件寿命早期的产生似乎与在先前的电学研究中观察到的器件寿命早期电导的初始降低有关。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Electrically Detected Magnetic Resonance Study of High-Field Stressing in SiOC:H Films
We have investigated the initial stages of dielectric breakdown in high-field stressed low-k dielectric (SiOC:H) capacitor structures. Our study makes use of electrically detected magnetic resonance (EDMR) via spin-dependent trap-assisted tunneling (SDTAT). We find at least two distinct stages precede the breakdown of the dielectrics: a very fast initial stage associated with an overall decrease in leakage current and a rapid generation of Si dangling bonds, and a much slower subsequent intermediate stage associated with an overall recovery of leakage current with little further Si dangling bond trap generation. The generation of these Si dangling bonds early-on in the device’s lifetime seems to be associated with the initial decrease in conductance very early in device lifetimes observed in previous electrical studies.
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