10nm以下技术的弹性挑战

R. Aitken, E. Cannon, M. Pant, M. Tahoori
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引用次数: 8

摘要

由于设备尺寸小,芯片制造技术的高度集成,以及异构集成带来的额外复杂功能,推动了芯片制造技术的进步,推动了计算系统的惊人增长。虽然这些系统的普及使新兴的应用领域成为可能,但是,这一趋势在设备和系统级别都面临着严峻的挑战。随着最小特征尺寸的不断缩小,大量漏洞会影响嵌入式和关键系统的健壮性、可靠性和弹性。其中一些因素是由纳米级制造过程的随机性引起的,而其他因素则是由于高频率和纳米级特性而出现的。本文概述了一些主要工业参与者对极端纳米技术所面临的新兴弹性挑战的看法。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Resiliency challenges in sub-10nm technologies
Improvements in chip manufacturing technology, driven by high degree of integration due to small device sizes and additional complex functionalities enabled by heterogeneous integration, have propelled an astonishing growth of computing systems. While the pervasiveness of these systems enables emerging application domains, however, this trend is facing serious challenges, both at device and system levels. As the minimum feature size continues to shrink, a host of vulnerabilities influence the robustness, reliability, and resiliency of embedded and critical systems. Some of these factors are caused by the stochastic nature of the nanoscale manufacturing process, while other factors appear because of high frequencies and nanoscale features. This paper overviews the vision by some of the key industrial players regarding the emerging resiliency challenges faced at the extreme nanoscale technologies.
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