模制矩阵阵列封装焊料桥接失效的研究

2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) Pub Date : 2012-11-01 DOI:10.1109/IEMT.2012.6521761

C. K. Foong, Wong Shaw Fong, Leong Jenn Seong, H. Yi, L. C. Kan, Kim Kay

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引用次数: 0

摘要

当将封装表面安装到主板上时，焊接桥接是一个常见的问题。已经进行了有限的研究，以了解模具化合物性能和基板设计之间的相互作用，以及它们如何与桥接有关。最近的一项研究表明，模具复合性能对带材局部单位共面性有明显的影响。本文还将讨论模型研究和材料表征工作的修复，以防止桥接。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Investigation of solder bridging failure for molded matrix array package

Solder bridging is a common issue when surface mounting a package to motherboard. Limited studies have been conducted to understand the interaction between mold compound properties and substrate design on package coplanarity and how they relate to bridging. A recent study showed a clear influence of mold compound properties on localized unit coplanarity within a strip. The paper will also discuss both the modeling study and materials characterization effort on the fixes to prevent bridging.

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来源期刊

2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)

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