微波诱导等离子体解封高Tg模化合物铜线器件

2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Pub Date : 2016-07-18 DOI:10.1109/IPFA.2016.7564332

J. Tang, J. Wang, T. Tan, M. Endo, K. Ng, L. Lee, C. Beenakker

{"title":"微波诱导等离子体解封高Tg模化合物铜线器件","authors":"J. Tang, J. Wang, T. Tan, M. Endo, K. Ng, L. Lee, C. Beenakker","doi":"10.1109/IPFA.2016.7564332","DOIUrl":null,"url":null,"abstract":"Epoxy mold compound with high Tg is used for high temperature applications such as automotive. However, downside of using high Tg EMC is the difficulty in preserving copper bond wires during acid decapsulation. The use of silver plated leadframes makes stitch bond exposure even more difficult as acid and conventional plasma etching easily attacks silver. A new decapsulation process is developed based on Microwave Induced Plasma etching to handle high Tg plastic copper wire packages.","PeriodicalId":206237,"journal":{"name":"2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"43 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-07-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Decapsulation of copper wire devices with high Tg mold compound using microwave induced plasma\",\"authors\":\"J. Tang, J. Wang, T. Tan, M. Endo, K. Ng, L. Lee, C. Beenakker\",\"doi\":\"10.1109/IPFA.2016.7564332\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Epoxy mold compound with high Tg is used for high temperature applications such as automotive. However, downside of using high Tg EMC is the difficulty in preserving copper bond wires during acid decapsulation. The use of silver plated leadframes makes stitch bond exposure even more difficult as acid and conventional plasma etching easily attacks silver. A new decapsulation process is developed based on Microwave Induced Plasma etching to handle high Tg plastic copper wire packages.\",\"PeriodicalId\":206237,\"journal\":{\"name\":\"2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"volume\":\"43 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-07-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA.2016.7564332\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2016.7564332","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 1

摘要

具有高Tg的环氧树脂模具化合物用于汽车等高温应用。然而，使用高Tg EMC的缺点是在酸解封装过程中难以保存铜键线。镀银引线框架的使用使得针键暴露更加困难，因为酸和传统的等离子蚀刻容易攻击银。提出了一种基于微波诱导等离子体刻蚀的高Tg塑料铜线封装解封工艺。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Decapsulation of copper wire devices with high Tg mold compound using microwave induced plasma

Epoxy mold compound with high Tg is used for high temperature applications such as automotive. However, downside of using high Tg EMC is the difficulty in preserving copper bond wires during acid decapsulation. The use of silver plated leadframes makes stitch bond exposure even more difficult as acid and conventional plasma etching easily attacks silver. A new decapsulation process is developed based on Microwave Induced Plasma etching to handle high Tg plastic copper wire packages.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

自引率

0.00%

发文量