高压电力电子用陶瓷基板:过去、现在和未来

Z. Valdez-Nava, D. Kenfaui, M. Locatelli, L. Laudebat, S. Guillemet
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引用次数: 11

摘要

在目前的工作中,我们报告了用于高压电力电子模块的陶瓷衬底技术的综述。这些技术将面临不同的挑战,以提高陶瓷基板的性能,从热,机械和介电性能的角度来看。我们从建筑和材料的角度描述了衬底设计的一些最新进展。特别提出了一种基于氮化铝的陶瓷基板设计与实现的新策略。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Ceramic substrates for high voltage power electronics: past, present and future
In the present work, we report a review of the ceramic substrate technologies used for high voltage power electronics modules. These technologies will be confronted with the different challenges undertaken to improve the properties of the ceramic substrate, from thermal, mechanical and dielectric performance point of view. We describe some of the current developments on the design of substrate both from the architecture and from the material points of view. In particular, a new strategy on the design and realization of a ceramic substrate based on aluminum nitride is presented.
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