缩放SOI CMOS在高频模拟电路中的适用性

N. Zamdmer, J. Plouchart, Jonghae Kim, Liang-Hung Lu, S. Narasimha, P. O'Neil, A. Ray, M. Sherony, L. Wagner
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引用次数: 34

摘要

在本文中,我们证明了SOI NMOS晶体管作为高带宽放大器的能力随着栅极长度缩小到50nm以下而不断提高。在Lpoly = 47 nm处实现了196 GHz的fT。跨导和输入电容在Lpoly = 47 nm处均未达到极限值。影响FET输入电阻和高频噪声的栅极片电阻变化不大,在Lpoly = 55 nm至77 nm范围内是一个可接受的值(7:/平方)。我们还介绍了0.13 pm部分耗尽SOI CMOS技术的四个特点,表明其适用于高频电路应用:射频噪声性能可与最先进的III-V器件相媲美,体型SOI fet实现与体型fet相同的低频噪声,多电平后端允许高密度和高q无源,以及RF电路中可忽略的浮体诱导抖动。1. 场效应晶体管扩展
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Suitability of Scaled SOI CMOS for High-Frequency Analog Circuits
In this paper we show that the ability of SOI NMOS transistors to function as high-bandwidth amplifiers continuously improves as gate length shrinks below 50 nm. fT of 196 GHz is achieved at Lpoly = 47 nm. Neither the transconductance nor the input capacitance reaches a limiting value at Lpoly = 47 nm. The gate sheet resistance, which influences the FET input resistance and high-frequency noise, shows little variation and is an acceptable value (7: /square) in the Lpoly = 55 nm to 77 nm range. We also present four features of an aggressively scaled 0.13-Pm partially-depleted SOI CMOS technology that show its suitability for high-frequency circuit applications: RF noise performance comparable to state-of-the art III-V devices, body-tied SOI FETs that achieve the same low-frequency noise as bulk FETs, a multilevel back-end that allows high-density and high-Q passives, and negligible floating-body-induced jitter in RF circuits. 1. FET scaling
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