铜柱FCQFN的高通量制样方法

2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Pub Date : 2016-07-18 DOI:10.1109/IPFA.2016.7564261

Ke-Ying Lin, Wenjing Wang, Sharon Chen

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引用次数: 1

摘要

提出了一种快速、高通量的Cu柱FCQFN封装失效分析样品制备方法。我们的方法有利于多个设备的同时解封装，并且减少了包装解封装步骤的数量。此外，样品制备的吞吐时间(TPT)从90分钟减少到30分钟。

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High-throughput sample preparation method for Cu pillar FCQFN

We present a fast and high-throughput sample preparation method for FA (failure analysis) of Cu pillar FCQFN package. Our method facilitates simultaneous decapsulation of multiple devices, and with reduced number of package decapsulation steps. Further, throughput-time (TPT) for sample preparation is reduced from 90 min to 30 min.

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来源期刊

2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

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