包内网络:性能管理和设计方法

A.M. Kouadri M, B. Senouci, F. Pétrot
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引用次数: 1

摘要

如今,嵌入多个处理器、存储器和专用ip的大规模MPSoC设计需要高集成密度,这在标准单芯片技术中是无法以可接受的成本满足的。系统包(SiP)方法被提议作为一种替代方案来实现这样的集成需求。尽管对系统级封装设计技术的分析显示与多芯片模块(MCM)的标准技术有很大的相似之处,但以通信为中心的mpsoc在方法论上存在巨大的缺乏。在本文中,我们激发了对新的设计方法的需求,这些方法解决了新兴NiP(包中网络)范式的各种问题,并特别关注性能考虑。我们还提出了一个完整的NoC架构(MS-NoC)和设计流程,旨在帮助设计师构建NiP架构。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Networks-In-Package: Performances management and design methodology
Nowadays large scale MPSoC designs embedding multiple processors, memories and specialized IPs require high integration densities which can not be met at an acceptable cost within the standard single-chip technology. The systems-in-package (SiP) approach has been proposed then as an alternative which enables such integration requirements. Even though analysis of systems-in-package design techniques shows large similarities with standard techniques for multi-chip-modules (MCM), there is a huge methodological lack for communication-centric MPSoCs. In this paper we motivate the need for new design methodologies which addresses the various problems of the emerging NiP (networks-in- package) paradigm with a special focus on performances considerations. We also propose a complete NoC architecture (MS-NoC) and a design flow aimed at helping designers to build NiP architectures.
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