{"title":"薄膜中宏观应力的形成及其x射线衍射研究","authors":"P. Šutta, Q. Jackuliak","doi":"10.1109/ASDAM.1998.730205","DOIUrl":null,"url":null,"abstract":"Elastic stresses and strains are almost always present in thin films deposited on substrates. In the majority of cases these stresses are residual stresses, introduced into the system during deposition or subsequent processing and they me mostly biaxial at the thin film substrate interface. Two significant reasons of macrostress formation in thin films can be distinguished thermal and/or epitaxial mismatch between the thin film and substrate thermal coefficients and lattice parameters.","PeriodicalId":378441,"journal":{"name":"ASDAM '98. Conference Proceedings. Second International Conference on Advanced Semiconductor Devices and Microsystems (Cat. No.98EX172)","volume":"99 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-10-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Macrostress formation in thin films and its investigation by X-ray diffraction\",\"authors\":\"P. Šutta, Q. Jackuliak\",\"doi\":\"10.1109/ASDAM.1998.730205\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Elastic stresses and strains are almost always present in thin films deposited on substrates. In the majority of cases these stresses are residual stresses, introduced into the system during deposition or subsequent processing and they me mostly biaxial at the thin film substrate interface. Two significant reasons of macrostress formation in thin films can be distinguished thermal and/or epitaxial mismatch between the thin film and substrate thermal coefficients and lattice parameters.\",\"PeriodicalId\":378441,\"journal\":{\"name\":\"ASDAM '98. Conference Proceedings. Second International Conference on Advanced Semiconductor Devices and Microsystems (Cat. No.98EX172)\",\"volume\":\"99 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1998-10-05\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ASDAM '98. Conference Proceedings. Second International Conference on Advanced Semiconductor Devices and Microsystems (Cat. No.98EX172)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ASDAM.1998.730205\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ASDAM '98. Conference Proceedings. Second International Conference on Advanced Semiconductor Devices and Microsystems (Cat. No.98EX172)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASDAM.1998.730205","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Macrostress formation in thin films and its investigation by X-ray diffraction
Elastic stresses and strains are almost always present in thin films deposited on substrates. In the majority of cases these stresses are residual stresses, introduced into the system during deposition or subsequent processing and they me mostly biaxial at the thin film substrate interface. Two significant reasons of macrostress formation in thin films can be distinguished thermal and/or epitaxial mismatch between the thin film and substrate thermal coefficients and lattice parameters.