{"title":"非常大阵列的金-金(Au-Au)热压(TC)键合","authors":"B.K. Kurman, S. Mita","doi":"10.1109/ECTC.1992.204311","DOIUrl":null,"url":null,"abstract":"The authors demonstrate a technique, very large array bonding (VLAB), that extends Au-Au TC bonding from a single connection or tens of connections, to thousands or tens of thousands of connections over a large area in a single joining cycle. A description of a semi-isostatic gas pressure press developed for joining metal and/or metal/polymer arrays onto ceramic or silicon substrates is presented. Bond yields of 99.97% for metal/polyimide thin film arrays containing nearly 60000 contacts to pads on a 127-mm ceramic substrate have been achieved.<<ETX>>","PeriodicalId":125270,"journal":{"name":"1992 Proceedings 42nd Electronic Components & Technology Conference","volume":"40 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1992-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"24","resultStr":"{\"title\":\"Gold-Gold (Au-Au) thermocompression (TC) bonding of very large arrays\",\"authors\":\"B.K. Kurman, S. Mita\",\"doi\":\"10.1109/ECTC.1992.204311\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The authors demonstrate a technique, very large array bonding (VLAB), that extends Au-Au TC bonding from a single connection or tens of connections, to thousands or tens of thousands of connections over a large area in a single joining cycle. A description of a semi-isostatic gas pressure press developed for joining metal and/or metal/polymer arrays onto ceramic or silicon substrates is presented. Bond yields of 99.97% for metal/polyimide thin film arrays containing nearly 60000 contacts to pads on a 127-mm ceramic substrate have been achieved.<<ETX>>\",\"PeriodicalId\":125270,\"journal\":{\"name\":\"1992 Proceedings 42nd Electronic Components & Technology Conference\",\"volume\":\"40 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1992-05-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"24\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1992 Proceedings 42nd Electronic Components & Technology Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.1992.204311\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1992 Proceedings 42nd Electronic Components & Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1992.204311","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Gold-Gold (Au-Au) thermocompression (TC) bonding of very large arrays
The authors demonstrate a technique, very large array bonding (VLAB), that extends Au-Au TC bonding from a single connection or tens of connections, to thousands or tens of thousands of connections over a large area in a single joining cycle. A description of a semi-isostatic gas pressure press developed for joining metal and/or metal/polymer arrays onto ceramic or silicon substrates is presented. Bond yields of 99.97% for metal/polyimide thin film arrays containing nearly 60000 contacts to pads on a 127-mm ceramic substrate have been achieved.<>
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