大型光背板总线

S. Yamaguchi, T. Hayashi, Y. Ohno, T. Mikazuki
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引用次数: 4

摘要

本文介绍了一种由光星形耦合器、光收发模块、光接收模块和光多模玻璃光纤组成的新型高速光背板总线。设计了一种由非球面透镜和激光二极管组成的高效光耦合结构,实现了高达90%的耦合效率,使光信号以高达1 Gb/s的速度分布在32个功能板上。在印刷电路板中嵌入光纤可以精确控制光传播延迟时间,并允许高封装密度。E/O和O/E模块的间距约为15mm。我们开发了小型激光二极管和光电二极管模块,适用于光耦合到嵌入式光纤的末端,通过使用对准工具。制作的8/spl倍/8原型光背板总线能够将高达1gb /s的高速光信号分发到具有高封装密度的功能板上。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Large-scale optical backboard bus
This paper describes an innovative high-speed optical backboard bus composed of an optical star coupler, optical-transmitter (E/O) modules, optical-receiver (O/E) modules, and optical multimode glass fibers. A highly efficient optical coupling structure with an aspherical lens and a laser diode was designed to achieve coupling efficiency of up to 90%, enabling the distribution of optical signals at up to 1 Gb/s to 32 functional boards. Embedded optical fibers in the printed circuit board are used to achieve precise control of the optical propagation delay time, and permit a high packaging density. E/O and O/E modules are placed with a pitch of about 15 mm. We developed small laser diode and photo diode modules suitable for optical coupling to the end of embedded fibers through the use of an alignment tool. A fabricated 8/spl times/8 prototype optical backboard bus was able to distribute high-speed optical signals of up to 1 Gb/s to function boards with a high packaging density.
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