{"title":"利用商业EM求解器快速算法分析嵌入式无源元件","authors":"K. Choi, M. Swaminathan","doi":"10.1109/EPEP.1997.634080","DOIUrl":null,"url":null,"abstract":"This paper discusses the analysis of embedded passive components using a rational polynomial approximation. The method combines the accuracy of full wave EM solvers with Cauchy's method to generate the interpolated response using a minimum number of frequency points. It is shown that the method is able to extract the resonance behaviors and quality factor (Q) of embedded passive components with minimum error.","PeriodicalId":220951,"journal":{"name":"Electrical Performance of Electronic Packaging","volume":"2677 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"11","resultStr":"{\"title\":\"Utilization of fast algorithm to analyze embedded passive components using commercial EM solvers\",\"authors\":\"K. Choi, M. Swaminathan\",\"doi\":\"10.1109/EPEP.1997.634080\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper discusses the analysis of embedded passive components using a rational polynomial approximation. The method combines the accuracy of full wave EM solvers with Cauchy's method to generate the interpolated response using a minimum number of frequency points. It is shown that the method is able to extract the resonance behaviors and quality factor (Q) of embedded passive components with minimum error.\",\"PeriodicalId\":220951,\"journal\":{\"name\":\"Electrical Performance of Electronic Packaging\",\"volume\":\"2677 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-10-27\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"11\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Electrical Performance of Electronic Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.1997.634080\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrical Performance of Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.1997.634080","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Utilization of fast algorithm to analyze embedded passive components using commercial EM solvers
This paper discusses the analysis of embedded passive components using a rational polynomial approximation. The method combines the accuracy of full wave EM solvers with Cauchy's method to generate the interpolated response using a minimum number of frequency points. It is shown that the method is able to extract the resonance behaviors and quality factor (Q) of embedded passive components with minimum error.