引线框架设计对铝线键合的影响

Tan Joo Hong, C. Kwee
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引用次数: 0

摘要

力、功率、时间、夹紧和砧块设计等参数是获得良好铝楔键合的重要因素。最初,引线框架设计有一个连接到模具桨的熔断引线。引线与模片的这种连接导致夹紧效果不佳,导致在可靠性应力后楔键升高。此外,在应力后发现的引线分层会使键合恶化。在本研究中,对引线框架设计进行了调查,以确定导致良好粘合完整性的夹紧概念的有效性。拉拔试验结果表明,与完全切割引线架(引线与模片之间没有连接)相比,部分切割引线架(引线与模片之间有狭窄的连接)上的楔形键键略弱。此外,在部分切割的铅上可以看到分层的扩展。然而,这种现象在全切铅上没有观察到。因此,在全切割引线框架设计上进行了进一步的可靠性强调,以进一步检查粘合的完整性。所有设备均通过了可靠性测试,包装为防潮等级3级包装。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Effect of leadframe design on aluminum wire bonding
Parameters such as Force, Power, Time, Clamping and Anvil block designs are important factors in obtaining a good aluminum wedge bond. Initially, the leadframe design has a fused lead connected to the die paddle. This connection of the lead to the die paddle causes ineffective clamping, resulting in lifted wedge bond after reliability stress. Moreover, the bonding is worsened by delamination at the leads, found after stress. In this study, investigations are done on the leadframe designs to determine the effectiveness of the clamping concept that lead to good bond integrity. Pull tests results showed that the wedge bonds bonded on Partial Cut leadframe (with narrow joint between the lead and die paddle) are slightly weaker as compared to those bonded on Full Cut leadframe (no joint between the lead and die paddle). Moreover, propagation of delamination is seen on the Partial Cut lead. This phenomenon is however, not observed on the Full Cut lead. Thus, further reliability stresses are performed on the Full Cut leadframe design to further check on the bond integrity. All units passed the reliability tests and the package is qualified as a Moisture Classification Level 3 package.
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