表面贴装集成电路中脱层对应力诱导和污染相关失效的影响

30th Annual Proceedings Reliability Physics 1992 Pub Date : 1992-03-01 DOI:10.1109/RELPHY.1992.187642

Thomas M. Moore, S. J. Kelsall

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引用次数: 37

摘要

本文报道了一种大型模具132针塑料四平面封装工艺的温度循环评估，其中包括三种模具化合物、两种引线框架饰面和两种有和没有聚酰亚胺模具涂层的模具表面条件的性能比较。研究了污染和湿气暴露对焊料回流过程中损坏的68针带铅芯片载体键合垫完整性的影响。

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The impact of delamination on stress-induced and contamination-related failure in surface mount ICs

A temperature-cycle evaluation is reported of a large-die 132-pin plastic quad flat pack process which includes a comparison of the performances of three mold compounds, two lead frame finishes, and two die surface conditions with and without a polyimide die overcoat. The effect of contamination and moisture exposure on bond pad integrity in 68-pin leaded chip carriers damaged during solder reflow was also examined.<>

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30th Annual Proceedings Reliability Physics 1992

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