使用基于阵列的表征电路的工艺窗口和器件变化评估

C. Tabery, M. Craig, G. Burbach, B. Wagner, S. McGowan, P. Etter, S. Roling, C. Haidinyak, E. Ehrichs
{"title":"使用基于阵列的表征电路的工艺窗口和器件变化评估","authors":"C. Tabery, M. Craig, G. Burbach, B. Wagner, S. McGowan, P. Etter, S. Roling, C. Haidinyak, E. Ehrichs","doi":"10.1109/ISQED.2006.107","DOIUrl":null,"url":null,"abstract":"Highly customizable and scaleable scribe-based circuits have been demonstrated as effective tools for gathering process window response curves and variations data not easily obtained through standard electrical test structure approaches or inline characterization. This work demonstrates the feasibility of using these types of circuits in design rule definition, mask validation, lithography margining, and OPC qualification and refinement. Finally, given their small form factors, they are easily adopted in high-volume manufacturing environments as process monitoring tools","PeriodicalId":138839,"journal":{"name":"7th International Symposium on Quality Electronic Design (ISQED'06)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"14","resultStr":"{\"title\":\"Process window and device variations evaluation using array-based characterization circuits\",\"authors\":\"C. Tabery, M. Craig, G. Burbach, B. Wagner, S. McGowan, P. Etter, S. Roling, C. Haidinyak, E. Ehrichs\",\"doi\":\"10.1109/ISQED.2006.107\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Highly customizable and scaleable scribe-based circuits have been demonstrated as effective tools for gathering process window response curves and variations data not easily obtained through standard electrical test structure approaches or inline characterization. This work demonstrates the feasibility of using these types of circuits in design rule definition, mask validation, lithography margining, and OPC qualification and refinement. Finally, given their small form factors, they are easily adopted in high-volume manufacturing environments as process monitoring tools\",\"PeriodicalId\":138839,\"journal\":{\"name\":\"7th International Symposium on Quality Electronic Design (ISQED'06)\",\"volume\":\"3 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2006-03-27\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"14\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"7th International Symposium on Quality Electronic Design (ISQED'06)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISQED.2006.107\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"7th International Symposium on Quality Electronic Design (ISQED'06)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISQED.2006.107","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 14

摘要

高度可定制和可扩展的基于刻写的电路已被证明是收集过程窗口响应曲线和变化数据的有效工具,这些数据不易通过标准电气测试结构方法或在线表征获得。这项工作证明了在设计规则定义、掩模验证、光刻边缘以及OPC鉴定和改进中使用这些类型电路的可行性。最后,考虑到它们的小尺寸,它们很容易在大批量制造环境中被用作过程监控工具
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Process window and device variations evaluation using array-based characterization circuits
Highly customizable and scaleable scribe-based circuits have been demonstrated as effective tools for gathering process window response curves and variations data not easily obtained through standard electrical test structure approaches or inline characterization. This work demonstrates the feasibility of using these types of circuits in design rule definition, mask validation, lithography margining, and OPC qualification and refinement. Finally, given their small form factors, they are easily adopted in high-volume manufacturing environments as process monitoring tools
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信